(LEAD) Samsung Electronics-AMD partnership(LEAD) Samsung Electronics to supply HMB4 chips for AMD's next-gen AI GPUs(ATTN: ADDS new photos)SEOUL, March 18 (Yonhap) -- Samsung Electronics Co. said Wednesday it has signed an agreement with Advanced Micro Devices Inc. (AMD) to supply its latest high bandwidth memory (HBM) chips for the U.S. firm's next-generation artificial intelligence (AI) accelerators.Under a memorandum of understanding (MOU), Samsung Electronics has been designated as a preferred supplier of HBM4 for AMD's Instinct MI455X, its latest graphics processing unit (GPU) for AI data centers, according to the company.Samsung Electronics Co. Vice Chairman Jun Young-hyun (L) and AMD Inc. Chief Executive Officer (CEO) Lisa Su pose for a photo after signing an agreement in Pyeongtaek, south of Seoul, on March 18, 2026, in this photo provided by Samsung. (PHOTO NOT FOR SALE) (Yonhap)The deal marks Samsung Electronics' first official HBM4 agreement since it began shipping the chips in February. Lisa Su, chief executive officer (CEO) of AMD, was visiting South Korea as part of the partnership deal arrangement.Samsung Electronics' sixth-generation HBM4 uses a 4-nanometer logic process on the base die to improve data control efficiency, enabling data transfer speeds of up to 13 gigabits per second (Gbps) and bandwidth of up to 3.3 terabits per second (Tbps).The two companies will also collaborate on high-performance double data rate 5 (DDR5) memory solutions to support AMD's Helios, a next-generation rack-scale AI platform, as well as AI data center GPUs.Samsung Electronics said they plan to expand cooperation beyond next-generation memory, including HBM4, to advanced foundry and packaging services to drive further innovation in the AI computing ecosystem.Samsung Electronics and AMD have partnered since 2007, with Samsung having supplied graphics double data rate (GDDR) dynamic random-access memory (DRAM) for AMD's graphics cards."Samsung and AMD share a common goal of advancing AI computing, and this agreement will expand the scope of our collaboration," Vice Chairman Jun Young-hyun said during an MOU signing ceremony held in Pyeongtaek, south of Seoul."From industry-leading HBM4 and next-generation memory architectures to cutting-edge foundry and packaging technologies, Samsung offers comprehensive capabilities to support AMD's AI road map."AMD Inc. Chief Executive Officer (CEO) Lisa Su (L) tours Samsung Electronics Co.'s production facilities in Pyeongtaek, south of Seoul, on March 18, 2026, in this photo provided by Samsung. (PHOTO NOT FOR SALE) (Yonhap)brk@yna.co.kr(END)
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