Samsung Electro-Mechanics wins 1.5 tln-won AI chip part deal in U.S.

Samsung Electro-Mechanics-US deal

Samsung Electro-Mechanics wins 1.5 tln-won AI chip part deal in U.S.

SEOUL, May 20 (Yonhap) -- Samsung Electro-Mechanics Co. said Wednesday it has signed a 1.5 trillion-won (US$992.9 million) deal to supply silicon capacitors, key components used in advanced semiconductor packages and chips, to a major technology company in the United States.

The electronic components affiliate of Samsung Electronics Co. said it will supply the silicon capacitors from January 2027 through December 2028 to an undisclosed U.S. customer.

Silicon capacitors are core components used in high-performance semiconductor packages, including graphics processing units for artificial intelligence (AI) servers and high-bandwidth memory chips.

Compared with multilayer ceramic capacitors, silicon capacitors are smaller, consume less power, and offer improved heat resistance and more precise capacitance control.

The company said it plans to strengthen its presence in the high-performance computing components market, including applications for autonomous driving systems and mobile devices, by expanding partnerships with global clients.

This undated photo provided by Samsung Electro-Mechanics Co. shows silicon capacitors, major parts for high-performing chips. (PHOTO NOT FOR SALE) (Yonhap)