Samsung named priority HBM4 supplier for AMD’s Instinct MI455X accelerators
Partnership expands to DDR5 server memory and potential foundry deals
Samsung Electronics signed a memorandum of understanding with AMD to expand collaboration on next‑generation AI memory and computing technologies, strengthening ties in the fast‑growing data‑center market. Under the agreement, Samsung becomes the preferred supplier of its HBM4 (high‑bandwidth memory) for AMD’s upcoming Instinct MI455X AI accelerators. They will also cooperate on DDR5 server memory and potential foundry production for future AMD chips.
Samsung’s HBM4, built on 1c DRAM and a 4‑nanometer base die, offers a data rate up to 13Gbps and bandwidth of 3.3TB/s. It entered mass production in February. The Korean company already supplies HBM3E for AMD’s current‑generation MI350X and MI355 accelerators and aims to strengthen its position in the HBM market by moving up to HBM4.
Samsung’s Jun Young‑hyun, head of the Device Solutions division (right), and AMD CEO Lisa Su pose for a photo after signing an MOU to expand collaboration on next‑generation AI memory and computing.
Beyond high‑bandwidth memory, Samsung will provide high‑performance DDR5 solutions for AMD’s sixth‑generation EPYC server CPUs and the Helios rack‑scale AI data‑center platform that integrates multiple servers at the rack level. The two companies also plan to explore foundry cooperation, under which some next‑generation AMD products would be manufactured at Samsung fabs, leveraging Samsung’s ability to offer memory, foundry, and advanced packaging as an integrated turnkey service.
Samsung and AMD have collaborated for roughly two decades across graphics, mobile, and computing platforms. “By combining leading‑edge HBM4, next‑generation memory architectures, and advanced foundry and packaging, Samsung can support AMD’s AI roadmap with a differentiated turnkey capability,” said Jun Young‑hyun, head of Samsung’s Device Solutions division. AMD CEO Lisa Su said close cooperation across the industry is essential to build next‑generation AI infrastructure, adding that pairing Samsung’s memory technology with AMD’s Instinct GPUs, EPYC CPUs, and rack‑scale platforms will be a key part of that effort. The companies said they intend to work more closely on memory solutions for AI and data‑center customers as demand for advanced accelerators continues to rise.
By Min Byung-kwun, KDFN
kdf＠kdfnews.com
Source_ⓒSamsung Electronics
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